5/28/2023 0 Comments Singlecrystal softwareWith appropriate selection of the machining parameters, desired machined surface with high phase purity and low subsurface damage can be achieved by TAC. Meanwhile, the annealing of the high-pressure phases into cubic silicon phase become apparent when the machining temperature is increased. During TAC process, the silicon workpiece is thermally softened, which causes the decrease of the cutting forces and specific cutting energy. In particular, the thermal assisted cutting (TAC) and vibration assisted cutting (VAC) have attracted widespread attention as its extraordinary cutting performance.įor brittle materials like single-crystal silicon, the brittle-to-ductile transition can be promoted when the machining temperature is increased. To overcome these problems, various assistive machining technologies have been proposed and tested. The machining efficiency and ability in fabricating complex structures are limited. Although the subsurface damage layer can be decreased to about 50 nm by grinding and polishing. In single-crystal diamond cutting (SPDT) machining, a damaged layer ranges from 200 to 600 nm can be formed depending on processing parameters. During micro-milling process, machining-induced interior type edge chipping defects can be generated in workpiece. However, due to the hardness and brittleness nature of single-crystal silicon, microscopic brittle fracture and subsurface damage can be generated during mechanical machining. Single-crystal silicon is an important semiconductor material, which has been widely used in infrared optics, microelectronics, and optoelectronics systems owing to its excellent optical and mechanical properties.
0 Comments
Leave a Reply. |